Baking and Dry Packing

A Leader in IC Baking & Dry Packing Services

Baking and Dry Packing Services with years of experience and state-of-the-art equipment… Googleplex Technologies is poised to help your company solve all of its electronics needs. We offer exceptional customer service and quick turn around times.

Many electronic components and devices are moisture sensitive and require specialized packaging to prevent moisture contamination and deterioration issues at the end user level. Typical plastic packaging can absorb water from the air. When circuit board assembly occurs, parts undergo high temperatures during reflow and any moisture trapped in the IC body can have very destructive effects. As the water absorbed by the part expands during reflow, both the silicon wafer and plastic body can be cracked, sometimes referred to as “pop corning” (from the sound as the parts are cracked by rapidly expanding water vapor). IC baking under a controlled environment safely dries the IC, coupled with dry-packing and moisture conscious handling, can eliminate this risk.

Googleplex Baking & Dry Packing Process

• Support of all surface mount components
• Electronic Industry Alliance IPC/JEDEC J-STD-033C-1 & JEP113
• Dry Bake/Dry Pack/Vacuum Sealing
• Quick Turn Around Times/Low Minimums
• ESD Safe